Advanced SMP/E and SYSMOD Packaging

This course provides delegates with a comprehensive grounding in the philosophy, capabilities, structure, commands and interactions within the SMP/E environment.

This course consolidates the delegates knowledge of installing and maintaining, using SMP/E, Program Products provided by IBM and other third party vendors. It delves under the covers of SMP/E and provides detailed practical insight into constructing and packaging your own SYSMODS.

Delegates should be reasonably familiar with SMP/E, attending our Effective use of SMP/E course would provide the ideal level of understanding.

The class will focus on constructing and packaging your own SYSMODS, starting with constructing USERMODS for vendor supplied FUNCTIONS and concluding with how to package as FUNCTION type SYSMODS products in non-SMP/E format. Wherever possible the instructor will relate the class to the client’s SMP/E environment. In particular the labs can be based around the clients own USERMODS and non-SMP/E packaged products.

Introduction to z/OS Product Processes.
Assessing Packaging requirements and considerations.
Contents of the Product Package.
SYSMOD types and relationships.
Fundamental Packaging considerations.
Naming conventions.
Elements and Load modules.
Using MCS to manipulate Elements and Load Modules.
Using MCS to define USERMODS.
Using MCS to define FUNCTIONS.
Using JCLIN.
Packaging for special situations.
National Language Support.